Founded in April 2008, Hangzhou Changchuan Technology Co., Ltd., is a high-tech enterprise dedicated to improving the technical level of IC special equipment and actively promoting the upgrading of IC equipment industry. In 17 April 2017, CCTECH was listed on the Shenzhen Stock Exchange (stock code: 300604).
The head office, CCTECH Building is located at No. 410, Jucai Road, Binjiang District, Hangzhou. At present, CCTECH has more than 3,500 employees, with more than 50% R&D personnel. It has branches in Japan, Taiwan, Shanghai, Beijing, Chengdu, Harbin, Suzhou, Neijiang, Changsha, Hefei and more, and has successively acquired Singapore AOI equipment manufacturer STI, the semiconductor business department of SATO in Japan and Malaysia test equipment manufacturer EXIS. With major markets in mainland China and Taiwan, CCTECH has also gradually expanded into international markets including the United States, the United Kingdom, Germany, South Korea, Singapore, Malaysia, Thailand, the Philippines and other countries.
CCTECH has been committed to independent research and development. It has currently more than 950 authorized patents at home and abroad, including more than 300 invention patents, establishing a strict intellectual property protection system. Some core performance indexes of the company's products have reached the international advanced level. CCTECH has been successively recognized as a High-tech Enterprise, a National Key Software Enterprise, a Specialized and New “Little Giant” SMEs of the Ministry of Industry and Information Technology of P.R.C., a National Intellectual Property Advantage Enterprise, the Zhejiang Provincial Leading Technology Enterprise, and more.
As a total solution provider in the IC packaging and testing industry, our major products are testers, handlers, probers, AOI equipment. We have been well recognized by the IC industry in that we boast advanced technology and have played a leading role in this industry for many years. Our products have been widely used in chip testing in automotive electronics, 5G communications, cloud computing, artificial intelligence and other fields.